| 摘要 |
A tape carrier for TAB(Tape Automated Bonding) and a method for manufacturing the same are provided to determine easily the position of failure on a metal line pattern by using a plurality of identification marks. A tape carrier for TAB includes an insulating layer, a plurality of metal line patterns, and a substrate. The insulating layer has a first surface and a second surface. The insulating layer is formed like a long type structure. A plurality of regions are arranged along a length direction of the insulating layer. The plurality of metal line patterns(12) are formed on the first surface of the insulating layer within the plurality of regions, respectively. The substrate is arranged on the second surface of the insulating layer. At this time, the plurality of regions of the insulating layer are exposed to the outside through the substrate. The substrate includes a plurality of identification marks(M2). |
