发明名称 LASER MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser machining apparatus capable of cutting a product from a stock material by the laser machining, automatically separating the product from a remaining material, and treating the product. <P>SOLUTION: The laser machining apparatus 1 comprises a laser machine 10 and a workpiece pallet automatic changing device 20. A stock material on a workpiece pallet 30 is separated into a product W<SB>1</SB>and a remaining material S<SB>1</SB>. A stock material pallet 110 of a rack warehouse 100 is fed to a feed position, and a stock material P<SB>1</SB>is fed onto the workpiece pallet by a second conveying device having a vacuum pad unit 300. The cut product W<SB>1</SB>is held by a vacuum pad unit 300, and fed to a product station 40. The remaining material S<SB>1</SB>on the workpiece pallet is fed to a tip conveyor 50 by a first conveying device 150 having a fork 152, and treated. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007054835(A) 申请公布日期 2007.03.08
申请号 JP20050239455 申请日期 2005.08.22
申请人 YAMAZAKI MAZAK CORP 发明人 YAMAZAKI TSUNEHIKO;MIYAGAWA NAOTOMI
分类号 B23K26/10;B23K26/38;B23K26/42 主分类号 B23K26/10
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