发明名称 METHOD OF MANUFACTURING SILICONE MOLDING DIE FOR MANUFACTURING STRUCTURE, AND SILICONE MOLDING DIE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a silicon molding die for effectively manufacturing a structure having a plurality of painless needles (fine needles). SOLUTION: The method for manufacturing the silicon molding die comprises exposing a region of a silicon substrate corresponding to a supporting plate part (2), covering a region corresponding to the fine needles part (4) with a metal film, etching the region corresponding to the supporting plate part (2), thereafter removing the metal film, and further etching. Thus, the molding die having a thickness corresponding to the supporting plate part (2) different from that corresponding to the fine needles part (4) is manufactured. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007055204(A) 申请公布日期 2007.03.08
申请号 JP20050246615 申请日期 2005.08.26
申请人 NANO DEVICE & SYSTEM RESEARCH INC;NABTESCO CORP 发明人 TOBINAGA YOSHIICHI;ONUMA KEISOKU
分类号 B29C33/38;B29L31/00;B82B1/00 主分类号 B29C33/38
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