发明名称 |
METHOD OF MANUFACTURING SILICONE MOLDING DIE FOR MANUFACTURING STRUCTURE, AND SILICONE MOLDING DIE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a silicon molding die for effectively manufacturing a structure having a plurality of painless needles (fine needles). SOLUTION: The method for manufacturing the silicon molding die comprises exposing a region of a silicon substrate corresponding to a supporting plate part (2), covering a region corresponding to the fine needles part (4) with a metal film, etching the region corresponding to the supporting plate part (2), thereafter removing the metal film, and further etching. Thus, the molding die having a thickness corresponding to the supporting plate part (2) different from that corresponding to the fine needles part (4) is manufactured. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007055204(A) |
申请公布日期 |
2007.03.08 |
申请号 |
JP20050246615 |
申请日期 |
2005.08.26 |
申请人 |
NANO DEVICE & SYSTEM RESEARCH INC;NABTESCO CORP |
发明人 |
TOBINAGA YOSHIICHI;ONUMA KEISOKU |
分类号 |
B29C33/38;B29L31/00;B82B1/00 |
主分类号 |
B29C33/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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