发明名称 SEMICONDUCTOR LAMINATION SUBSTRATE AND ITS MANUFACTURING METHOD AS WELL AS SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor lamination substrate useful for manufacturing a semiconductor light emitting device of a higher luminance, and a method of manufacturing the semiconductor lamination substrate, as well as the semiconductor light emitting device. <P>SOLUTION: A semiconductor lamination substrate 1 for a nitride semiconductor light emitting device is formed of nitride semiconductor layers constituted by laminating an n-type nitride semiconductor layer 3, a light emitting layer 4, and a p-type nitride semiconductor layer 5 on a substrate 2 in this order. In the substrate 1, the p-type nitride semiconductor layer 5 consists of nitride semiconductor layers in which a large number of inorganic particles 6 are allotted, and a part of the inorganic particles 6 is exposed on a front surface of the p-type nitride semiconductor layer 5. Consequently, the semiconductor light emitting device given by the semiconductor lamination substrate 1 shows a high luminance. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007059762(A) 申请公布日期 2007.03.08
申请号 JP20050245499 申请日期 2005.08.26
申请人 SUMITOMO CHEMICAL CO LTD 发明人 UEDA KAZUMASA;KASAHARA KENJI;TAKADA TOMOYUKI
分类号 H01L21/205;H01L33/06;H01L33/32;H01L33/34 主分类号 H01L21/205
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