| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent adhering of adhesive which flows out from a diamond pattern to other pattern prepared on a substrate surface when a sensor chip is adhered on the diamond pattern. <P>SOLUTION: The diamond pattern 11 for placing the sensor chip on a circuit substrate 1 is made by pattern formation on the circuit substrate 1, and a ditch-like trench 14 is formed between the diamond pattern 11 by installing a leakage prevention pattern 13 in a surrounding part of the diamond pattern 11. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
