| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board where cost is reduced and productivity is improved by reusing normal inner layer members which are disposed conventionally by disposing only defective inner layer members, and where precision in positioning between the inner layer members is never degraded. SOLUTION: The manufacturing method of the multilayer wiring board provides marks 2 for forming positioning holes at opposing positions of the side ends on both of the sides of the inner layer members 1, thereafter batch forms a pair of positioning holes at the positions of the marks 2 of the inner layer members 1 by punching work, and next performs alignment between the inner layer members 1 to form the multilayer wiring board. By providing two or more pairs of marks 2 for forming the positioning holes at the ends on both of the sides of the inner layer members 1, a plurality of times of punching work is made to be possible, and a pair of positioning holes are formed at the positions of the marks 2 different from the positions of punched marks 2. COPYRIGHT: (C)2007,JPO&INPIT |
