| 摘要 |
This invention provides a soldering method capable of solving soldering defects due to excess molten solder in the case of soldering while applying an inner pressure into a through-hole of a lead component mounting substrate: (a) In a primary soldering step, a lead component mounting substrate is lowered, and the rear surface thereof is put close to or brought into close contact with an upper end opening edge of a nozzle. Simultaneously, the soldering surface of the molten solder supplied to the nozzle is elevated. (b) In a secondary soldering step, the rear surface of the lead component mounting substrate is relatively spaced from the soldering surface of molten solder by lowering the soldering surface. (c) In a lead separating step, the lead component mounting substrate is elevated while tilting the lead component mounting substrate.
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