发明名称 Plasma processing apparatus and method
摘要 A plasma processing apparatus includes: a processing chamber; a state detector for detecting a state of plasma in the processing chamber; an input unit for inputting process result data of a specimen processed in the plasma processing chamber; and a controller including a prediction equation forming unit for forming a prediction equation of a process result in accordance with plasma state data detected with the state detector for the plasma process simulating a specimen existing state in the processing chamber in a specimen non-placed state and process result data of the specimen input with the input unit and processed by the plasma process in a specimen placed state, and storing the prediction equation, wherein the controller predicts the process result of a succeeding plasma process in accordance with plasma state data newly acquired via the state detector in the specimen non-placed state and the stored prediction equation.
申请公布号 US2007051470(A1) 申请公布日期 2007.03.08
申请号 US20060362024 申请日期 2006.02.27
申请人 IWAKOSHI TAKEHISA;TANAKA JUNICHI;KITSUNAI HIROYUKI;MASUDA TOSHIO;SHIRAISHI DAISUKE 发明人 IWAKOSHI TAKEHISA;TANAKA JUNICHI;KITSUNAI HIROYUKI;MASUDA TOSHIO;SHIRAISHI DAISUKE
分类号 B08B3/12;B08B6/00;C23C16/00;C23F1/00;G06F19/00 主分类号 B08B3/12
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