发明名称 PLASMA ETCHING APPARATUS
摘要 A plasma etching apparatus is provided to avoid a match defect between a coil and an etch chamber even if a PM(preventive maintenance) process for opening the cover of the etch chamber is performed. An electrostatic chuck(120) is included in an etch chamber(110). A cathode part(130) supplies a predetermined RF voltage to the electrostatic chuck. A plasma induction part(140) supplies a predetermined RF voltage to the etch chamber, disposed over the etch chamber. A quartz disk assembly part on which a conductive layer is coated is interposed between the etch chamber and the plasma induction part, including a dome-type quartz plate(151) and a copper layer(152) coated on the upper surface of the quartz plate.
申请公布号 KR20070024210(A) 申请公布日期 2007.03.02
申请号 KR20050078906 申请日期 2005.08.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOU, DUCK SU
分类号 H01L21/3065 主分类号 H01L21/3065
代理机构 代理人
主权项
地址