BOARD HAVING ELECTRONIC PARTS MOUNTED BY USING UNDER-FILL MATERIAL AND METHOD FOR PRODUCING THE SAME

摘要

A board 1 according to the present invention includes a board main body 3 ; electronic parts 5 electrically connected to and mounted on the board main body 3 ; and an under-fill material 19 with which a part between the board main body 3 and a surface of the electronic parts 5 electrically connected to the board main body is filled. A hole 21 passing through a layer 19 a of the under-fill material that flows outside from a connecting area of the electronic parts 5 and the board main body 3 is provided for electrically connecting other parts to the board main body.