| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve a roll-off (an rolled edge) at the periphery of a wafer by optimizing chemical components for ensuring a polishing speed required in a primary polishing, in consideration of conditions in which the effect of the roll-off (the rolled edge) of the periphery of the wafer gets serious with an increase in the diameter of the wafer on the obtaining rate of chips, and in which the reduction of the roll-off results in a large problem for manufacturers of a silicon wafer. <P>SOLUTION: A polishing composition used for polishing the silicon wafer contains at least abrasive grains and a nitrogen-containing basic compound. In the composition, the concentration of the abrasive grains is set at a value from 1 to 10 wt.%. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
