| 摘要 |
<p>An improved method of bonding an insulated wire ( 14 ) that has one end connected to a first bond pad ( 16 ) to a second bond pad ( 18 ) includes moving a tip of a capillary ( 20 ) holding the bond wire ( 14 ) over the surface of the second bond pad ( 18 ) such that the bond wire ( 14 ) is rubbed between the capillary tip ( 20 ) and the second bond pad ( 18 ), which tears the bond wire insulation so that at least a portion of a metal core of the wire ( 14 ) contacts the second bond pad ( 18 ). The wire ( 14 ) is then bonded to the second pad ( 18 ) using thermocompression bonding. The tip of the capillary ( 20 ) is roughened to enhance the tearing of the bond wire insulation.</p> |
