| 摘要 |
An assembly ( 100 ) is provided which allows high power packaged power components ( 122 ) to operate at optimum power levels without degradation in performance. The assembly includes a heat sink ( 102 ), a printed circuit board (pcb) isolator ( 104 ) and a contact ring ( 106 ). The pcb isolator ( 104 ) provides electrical contacts ( 108, 128 ) upon which to mount the component and includes an opening ( 110 ) through which the component is soldered to the heat sink ( 102 ). The contact ring ( 106 ) is mounted to the pcb isolator ( 104 ) to form a cavity ( 124 ) within which the component ( 122 ) is contained. The assembly ( 100 ) can be coupled into a product having a chassis ( 320 ) and a product circuit board ( 324 ) such that the contact ring ( 106 ) is soldered to the product circuit board for electrical connection, and the heat sink is thermally coupled to the product chassis for heat dissipation.
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