| 发明名称 |
Thermally conductive phase change materials |
| 摘要 |
<p>A phase change composition comprises: a matrix comprising a silicone-organic block copolymer, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase change temperature.</p> |
| 申请公布号 |
EP1757659(A2) |
申请公布日期 |
2007.02.28 |
| 申请号 |
EP20060076877 |
申请日期 |
2003.03.18 |
| 申请人 |
DOW CORNING CORPORATION |
发明人 |
BHAGWAGAR, DORAB;MOJICA, ANDREW;NGUYEN, KIMMAI THI |
| 分类号 |
C08L53/00;C08L83/10;C08G77/00;C08G81/00;C08K3/00;C08K5/13;C08K5/5415;H01L23/36;H05K7/20 |
主分类号 |
C08L53/00 |
| 代理机构 |
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代理人 |
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| 地址 |
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