发明名称 |
Electronic package with thermally-enhanced lid |
摘要 |
Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.
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申请公布号 |
US7183642(B2) |
申请公布日期 |
2007.02.27 |
申请号 |
US20020241994 |
申请日期 |
2002.09.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BHATTACHARYA ANANDAROOP;CALMIDI VARAPRASAD V.;SATHE SANJEEV B. |
分类号 |
H01L23/36;H01L21/56;H01L23/31;H01L23/34;H01L23/42;H01L31/024 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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