| 摘要 |
A chemical mechanical polishing pad ( 200, 300, 400, 500, 600 ) that includes a translucent windowpane ( 220, 320, 404, 516, 524, 604 ) that allows optical measurements to be made using light energy reflected from the surface of a wafer ( 212, 324, 608 ) or other object being polished. The windowpane includes a trailing end ( 350, 416, 632 ) and a leading end ( 348, 412, 628 ) each having a streamlined shape so as to reduce the disturbance to the flow of a polishing medium ( 216 ) around the windowpane. The polishing pad may further include grooves ( 336, 428, 520, 640 ) that are diverted around the windowpane so as to provide a continuous path for the polishing medium in the region of the windowpane.
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