发明名称 Method and apparatus to control the temperature ofa component
摘要 <p>When a component, such as a memory device, exhibits an overtemperature condition (e.g., exceeds a first threshold value), the data transmission rate with respect to the component is reduced so as to lower its operating temperature. In one embodiment, this is achieved by changing the latency at which data packets are transmitted to and from the memory device in dependance on the temperature of the device. Controlling temperature in such a fashion allows for efficient use of the component over a large range of temperatures.</p>
申请公布号 HK1041975(A1) 申请公布日期 2007.02.23
申请号 HK20020103763 申请日期 2002.05.17
申请人 INTEL CORPORATION 发明人 SATCHITANAND JAIN;DENNIS REINHARDT;SUNG-SOO CHO
分类号 G11C;G11C7/04;G11C7/22;G11C11/406 主分类号 G11C
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