| 摘要 |
PROBLEM TO BE SOLVED: To easily remove a semiconductor chip after dicing from a semiconductor wafer affixed on an UV sheet by curing not only the viscous surface section on the back of the semiconductor chip but also a viscous layer section projecting from the semiconductor chip by contriving an irradiation method of UV light. SOLUTION: A light reflection material 6 is affixed on the back of the UV sheet 1, UV light 8 is irradiated from the surface side of the semiconductor wafer 3, and the viscous layer section 4b projecting from the semiconductor chip 2 near a dicing surface 5 is cured. Before or after the process, the light reflection material 6 is removed, UV light 7 is irradiated from the back side of the UV sheet 1, and the viscous layer section 4a on the back of the semiconductor chip in the UV sheet 1 is also cured. COPYRIGHT: (C)2007,JPO&INPIT |
