| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering device capable of effectively preventing faulty soldering, such as non-wetting, bridging or the like which is generated on the soldering surface of a substrate through a simple constitution, and capable of remarkably improving the quality and yield of soldering. SOLUTION: Solder supplied to a soldering region S above a solder tank 11 from a secondary injecting pump 14 is guided by the slope 16a of a former 16 for secondary flow of injection, to make the solder flow down into a recess 18 in a downstream along the slope 16a from the soldering region S. A chevron-type forming plate 16 is arranged by projecting a part of upper side from the slope 16a, so as to intersect orthogonally to the flow direction of the solder at the lower side in the slope 16a of the former 16, and to become substantially horizontal at the upper end of the slope 16a. A chevron with its ridge line substantially orthogonal to the flow direction of the solder is formed by the plate 16 for forming the chevron on the half way of the flow of solder which flows down into the recess 18 in the downstream along the slope 16a of the former 16 for secondary injection flow. COPYRIGHT: (C)2007,JPO&INPIT |
