发明名称 Integrated circuit arrangement, has capacitor in conduction path layer and provided with ground electrode, dielectric, and cover electrode
摘要 <p>An integrated circuit arrangement (110) has a capacitor (150) having a ground electrode (208), a capacitor dielectric (209) and a cover electrode (210), in which the ground electrode consists of another material to that of the control structures. Several control/conduction structures (140) and their inter-spaces form, in comparison to a flat/even surface, the same outline/contour as the capacitor (150), about at least 30 per cent extended uneven surface, on which the capacitor (150) is arranged. An independent claim is included for a method for fabricating a capacitor in a conduction path layer.</p>
申请公布号 DE102005038219(A1) 申请公布日期 2007.02.22
申请号 DE20051038219 申请日期 2005.08.12
申请人 INFINEON TECHNOLOGIES AG 发明人 STELTENPOHL, ANTON
分类号 H01L27/08;H01L21/822;H01L23/52 主分类号 H01L27/08
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