SUBSTRATE HOLDING DEVICE, SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate holding device which can surely prevent infiltration of chemicals to the rear surface of a substrate, and to provide a semiconductor manufacturing apparatus. SOLUTION: A substrate 3 is sucked and held on a substrate holder 11A provided on a rotary shaft 10B. A gas jetting port 12B communicating with a gas supply passage 12A is provided on the side wall of the substrate holder 11A. The gas jetting port 12B is extended at an angle ofαagainst the horizontal direction so that it may face the rear surface of the substrate 3. Before a resist 4 is supplied from a nozzle 5, an inert gas supplied from an inert gas supply 6 is jetted from the gas jetting port 12B to the rear surface of the substrate through the gas supply passage 12A. COPYRIGHT: (C)2007,JPO&INPIT