Method of plasma etching dielectric materials,申请号KR20077000756-传众专利搜索

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发明名称	Method of plasma etching dielectric materials
摘要
申请公布号	KR20070020325(A)	申请公布日期	2007.02.20
申请号	KR20077000756	申请日期	2007.01.11
申请人		发明人
分类号	H01L21/3065;H01L21/311	主分类号	H01L21/3065
代理机构		代理人
主权项
地址

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