INTEGRATED LIQUID COOLING SYSTEM FOR ELECTRONIC COMPONENTS

摘要

An integrated liquid cooling system ( 100 ) includes a heat absorbing member ( 10 ), a heat dissipating member ( 20 ) and a pump ( 15 ). The heat absorbing member defines therein a fluid flow channel ( 115 ) for passage of a coolant and a pump receiving housing ( 120 ) adjacent to the fluid flow channel. The heat dissipating member is mounted to and maintained in fluid communication with the heat absorbing member. The pump is received in the pump receiving housing of the heat absorbing member. The pump is configured for driving the coolant to circulate through the heat absorbing member and the heat dissipating member. The heat absorbing member, the heat dissipating member and the pump of the liquid cooling system are combined together to form an integrated structure without utilizing any connecting pipes.