发明名称 Pressure-sensitive adhesive sheet, production method thereof and method of processing articles
摘要 To provide a pressure-sensitive adhesive sheet for use in processing wafers and the like articles, that produces less cutting sludge of the pressure-sensitive adhesive sheet and that can follow up unevenness of a wafer even when a difference in height of the unevenness is large, the pressure-sensitive adhesive sheet includes a base having on one surface thereof an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an initial elastic modulus of 0.5 N/mm<SUP>2 </SUP>or less, a loss tangent (tandelta) at 20° C. to 70° C. of 0.4 or more, and a gel fraction of 30% or more
申请公布号 US2007036930(A1) 申请公布日期 2007.02.15
申请号 US20060500118 申请日期 2006.08.07
申请人 NITTO DENKO CORPORATION 发明人 KONTANI TOMOHIRO;YOSHIDA YOSHINORI;SHINTANI TOSHIO;AKAZAWA KOUJI
分类号 B32B33/00 主分类号 B32B33/00
代理机构 代理人
主权项
地址