发明名称 HEATING DEVICE AND WAFER PROBER MOUNTED WITH SAME
摘要 PROBLEM TO BE SOLVED: To provide an easy-to-manufacture and highly reliable heating device, and to provide a wafer prober mounted with the same. SOLUTION: The heating device comprises a mounting stand for mounting an article to be treated, and a heater for heating the mounting stand wherein the heater has a heating element formed on an insulating sheet. The heating element is preferably covered with a protective layer at least partially and it is preferably metal foil. The protective layer is preferably composed of heat-resistant rubber and the insulating sheet is composed of heat-resistant resin. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007042704(A) 申请公布日期 2007.02.15
申请号 JP20050222492 申请日期 2005.08.01
申请人 SUMITOMO ELECTRIC IND LTD 发明人 ITAKURA KATSUHIRO;NATSUHARA MASUHIRO;AWAZU TOMOYUKI;NAKADA HIROHIKO
分类号 H01L21/66 主分类号 H01L21/66
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