发明名称 |
METHOD FOR FORMING CHIP ARRAY ON WAFER |
摘要 |
A method for forming a chip array on a wafer is provided to form a plurality of chips on edge parts of the wafer by modifying a wafer map necessary for arranging the chips within the wafer. A method for forming a chip array on a wafer is characterized in that chips(101) arranged on a center part(110) of a wafer(100) are perpendicular to chips(105) arranged on edge parts(150) of both sides of the wafer when the chips are arranged on the wafer. The method includes a process for arranging the chips on the edge parts of the wafer in a direction perpendicular to a constant direction of the center part of the wafer when the chips are arranged in the constant direction of the center part of the wafer.
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申请公布号 |
KR100686455(B1) |
申请公布日期 |
2007.02.15 |
申请号 |
KR20050131521 |
申请日期 |
2005.12.28 |
申请人 |
DONGBU ELECTRONICS CO., LTD. |
发明人 |
JEONG, HYEONG GYUN |
分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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