发明名称 METHOD FOR FORMING CHIP ARRAY ON WAFER
摘要 A method for forming a chip array on a wafer is provided to form a plurality of chips on edge parts of the wafer by modifying a wafer map necessary for arranging the chips within the wafer. A method for forming a chip array on a wafer is characterized in that chips(101) arranged on a center part(110) of a wafer(100) are perpendicular to chips(105) arranged on edge parts(150) of both sides of the wafer when the chips are arranged on the wafer. The method includes a process for arranging the chips on the edge parts of the wafer in a direction perpendicular to a constant direction of the center part of the wafer when the chips are arranged in the constant direction of the center part of the wafer.
申请公布号 KR100686455(B1) 申请公布日期 2007.02.15
申请号 KR20050131521 申请日期 2005.12.28
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 JEONG, HYEONG GYUN
分类号 H01L21/02 主分类号 H01L21/02
代理机构 代理人
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