| 发明名称 |
Damascene processing using dielectric barrier films |
| 摘要 |
Damascene processing is implemented with dielectric barrier films for improved step coverage and reduced contact resistance. Embodiments include the use of two different dielectric films to avoid misalignment problems. Embodiments further include dual damascene processing using Cu metallization.
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| 申请公布号 |
US2007035025(A1) |
申请公布日期 |
2007.02.15 |
| 申请号 |
US20060585215 |
申请日期 |
2006.10.24 |
| 申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
YANG KAI;ERB DARRELL M.;WANG FEI |
| 分类号 |
H01L21/3205;H01L21/4763;H01L21/768;H01L23/52 |
主分类号 |
H01L21/3205 |
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