| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To surely cool the heat of heating elements provided on a main substrate and a sub-substrate by a single heat exchanger even if the heating elements have height error, inclination or the like. <P>SOLUTION: The electronic equipment comprises a first circuit board; a first heating element mounted thereon; a first heat receiving part thermally connected to the first heating element; a second circuit board arranged in parallel to the first circuit board; a second heating element mounted thereon; a second heat receiving part thermally connected to the second heating element; a first heat transfer means transferring heat conducted to the first heat receiving part; a second heat transfer means transferring heat conducted to the second heat receiving part; a radiation means thermally connected to the first heat transfer means and the second heat transfer means and radiating the heat of the first heat receiving part and the second heat receiving part; and a support means supporting the second circuit board displaceably to the first circuit board. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
