| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure and a method for mounting an electronic component by which the rigidity of a solder joint can be ensured by a simple and convenient method and reliability after mounting can be also improved. <P>SOLUTION: The structure for mounting an electronic component is designed to mount an electronic component 8 with a bump wherein a solder bump is formed on a connection electrode 9, to a substrate 2. In this case, an underfill resin is applied into a recess 6 which is provided at a mounting position and in which a resist film 2b is formed, and then, when the solder bump is joined to a circuit electrode 4 of the substrate 2 by soldering, a melted solder is wetted and extended along a surface-layer wiring 5 from the circuit electrode 4, so that a solder joint 10 contracted in its intermediate part is formed. At the same time, the underfill resin is thermally cured in the recess 6 to form a resin reinforcing part 7 for reinforcing the solder joint 10. Thus, discontinuity of shape in the solder joint 10 can be prevented, and a simple and convenient method is used to ensure the rigidity of the solder joint 10, so as to improve reliability after mounting. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
