发明名称 TEST METHOD FOR ACCELERATION SENSOR
摘要 <p><P>PROBLEM TO BE SOLVED: To accurately and efficiently test the bonding of anode with a test method for an acceleration sensor formed by bonding glass to an anodic bonding pattern on a semiconductor chip. <P>SOLUTION: In the test method for an acceleration sensor formed by contacting an upper glass 33 to aluminum electrode 6 on a silicon substrate 1 of a sensor 10 and anodic-bonding, measurement terminals 6a and 6b are provided on both ends od the aluminum electrode 6. A probe 9 is applied to this and the resistance value between the front and the back of the anodic bonding is measured with a resistance meter 11. By comparing the measured resistance values, the test of bonding performance of the aluminum electrode 6 and the upper glass 3 can be done quantitatively, accurately and efficiently. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007033214(A) 申请公布日期 2007.02.08
申请号 JP20050216526 申请日期 2005.07.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 AKAI SUMIO;KAMI HIRONORI;AOKI AKIRA
分类号 G01P21/00;G01P15/12;H01L29/84 主分类号 G01P21/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利