发明名称 |
TEST METHOD FOR ACCELERATION SENSOR |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To accurately and efficiently test the bonding of anode with a test method for an acceleration sensor formed by bonding glass to an anodic bonding pattern on a semiconductor chip. <P>SOLUTION: In the test method for an acceleration sensor formed by contacting an upper glass 33 to aluminum electrode 6 on a silicon substrate 1 of a sensor 10 and anodic-bonding, measurement terminals 6a and 6b are provided on both ends od the aluminum electrode 6. A probe 9 is applied to this and the resistance value between the front and the back of the anodic bonding is measured with a resistance meter 11. By comparing the measured resistance values, the test of bonding performance of the aluminum electrode 6 and the upper glass 3 can be done quantitatively, accurately and efficiently. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
申请公布号 |
JP2007033214(A) |
申请公布日期 |
2007.02.08 |
申请号 |
JP20050216526 |
申请日期 |
2005.07.26 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
AKAI SUMIO;KAMI HIRONORI;AOKI AKIRA |
分类号 |
G01P21/00;G01P15/12;H01L29/84 |
主分类号 |
G01P21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|