发明名称 MANUFACTURING METHOD OF SURFACE ACOUSTIC WAVE ELEMENT, AND THE SURFACE ACOUSTIC WAVE ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of surface acoustic wave elements, in which the dispersion in the resonance frequencies among surface acoustic wave elements, formed from one and same wafer, is reduced. SOLUTION: In the manufacturing method of the surface acoustic wave elements 14, an electrode pattern including an IDT 16 configured with interdigital electrodes 18 (18a, 18b) in pairs each provided with a plurality of electrode fingers is formed on a piezoelectric substrate, parts of the electrode fingers 17 are selected among the electrode fingers 17 configuring the interdigital electrodes 18, photoresist 22 is applied on the electrode pattern other than the parts of the electrode fingers 17, and the exposed parts of the electrode fingers 17 are etched to adjust the thickness of the electrode film. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007036670(A) 申请公布日期 2007.02.08
申请号 JP20050217094 申请日期 2005.07.27
申请人 SEIKO EPSON CORP 发明人 IIZAWA KEIGO
分类号 H03H3/10 主分类号 H03H3/10
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