| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pattern manufacturing system for suppressing irregularity from occurring on line width of a pattern line by irregularity of thickness of a conductor formed on a substrate, and to provide an exposure device and an exposure method. <P>SOLUTION: The pattern manufacturing system comprises imaging a plurality of kinds of copper thicknesses of test substrates forming a test pattern including the pattern lines of various line widths by an image recognizing means 60, and preparing a correction table indicating corresponding relationship of the copper thickness, the line width and an exposure correction amount by really measuring the line width of the pattern line. The pattern manufacturing system comprises measuring the copper thickness of a copper foil formed on the substrate by a copper thickness measuring part 9 on each substrate when forming a circuit pattern on the substrate, finding the exposure correction amount corresponding to the measured copper thickness from the correction table, and correcting an exposure amount by the found exposure correction amount. <P>COPYRIGHT: (C)2007,JPO&INPIT |
