CHEMICAL MACHINERY POLISHING APPARATUS, PAD CONDITIONER ASSEMBLY AND POLISHING PAD CONDITIONING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a chemical machinery polishing apparatus, a pad conditioner assembly and a polishing pad conditioning method.

SOLUTION: The present invention relates to a chemical machinery polishing apparatus 100, a pad conditioner assembly 160, and a polishing pad conditioning method. The chemical machinery polishing apparatus 100 polishes a wafer W by rotating a carrier 130 with the wafer W mounted on its lower surface while supplying slurry 150 to a polishing table 110 with a polishing pad 120 mounted on its upper surface. The chemical machinery polishing apparatus 100 includes the pad conditioner assembly 160, and the pad conditioner assembly 160 conditions the polishing pad 120 by providing a pad conditioning solution 190 to the polishing pad 120, applying ultrasonic vibration to the solution and removing a foreign material from the surface of the polishing pad 120.

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