| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink excellent in a reliability and a versatility. SOLUTION: The heat sink that cools a semiconductor device by radiating heat includes: a leg body covering the semiconductor device with a female screw vertically formed through at the center of the covering face; a heatsink body with a fin for radiating heat to the upper face formed and having the male screw formed with a planar apical surface projecting downward at the center of the lower face with screwing together with the female screw; a thermally conductive buffer body interposed so as to uniformly bring the apical surface of the male screw into close contact with the upper face of the semiconductor device; and a groove fitting to the predetermined driver formed at the center of the fin-formation part of the upper face of the heatsink body. COPYRIGHT: (C)2007,JPO&INPIT
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