| 摘要 |
PROBLEM TO BE SOLVED: To prevent short circuit, disconnection, etc. caused by the variations in the thickness of circuit patterns, that are repeatedly laminated on a substrate by discharging a solution for conductive patterns and a solution for insulating patterns from a liquid discharge head. SOLUTION: To a substrate 101 on a stage 102, a solution is discharged from two head parts (liquid discharge heads) 100a and 100b individually, while scanning a carriage 100 to form a circuit pattern B. After the circuit pattern A at the first layer is formed, one head part 100b, for example, is shifted in a stage-moving direction, to start the scanning of the carriage 100, when laminating the circuit pattern at the second layer on top of that. Variations in the thickness of the circuit pattern are averaged out, by preventing the locations of the nozzles of the head part 100b in the formation of a plurality of layers of circuit patterns from superimposing. COPYRIGHT: (C)2007,JPO&INPIT |
