| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for unifying the temperature distribution of a semiconductor chip as much as possible. SOLUTION: In the semiconductor device, the center power density of the semiconductor chip is reduced, power density is increased toward the periphery of the chip, and temperature distribution in the chip is reduced. In the semiconductor device, a region for preventing element cells from being formed is created in the semiconductor chip, and the area density is adjusted, thus reducing cell density in the semiconductor chip, increasing cell density toward the periphery of the chip, and reducing temperature distribution in the chip. In the semiconductor device, elements are formed uniformly in the semiconductor chip but wiring is made to prevent operation for one portion of the elements, thus reducing operating element cell density in the semiconductor chip, increasing non-operating cell density toward the periphery of the chip, and reducing temperature distribution in the chip. COPYRIGHT: (C)2007,JPO&INPIT
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