| 摘要 |
PROBLEM TO BE SOLVED: To provide a reinforcing film for flexible printed circuit board for controlling interface peeling generated between the flexible printed circuit board and reinforcing film in the reflow process during mounting. SOLUTION: The reinforcing film for flexible printed circuit board is formed of a heat-resistant resin of the layered structure including at least one bubble mixing layer. COPYRIGHT: (C)2007,JPO&INPIT
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