| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a undulation inspecting device which can readily inspect the state (film thickness difference) of the surface relief and with high accuracy also with respect to the large-size substrate (color filter substrate, etc.). <P>SOLUTION: The undulation inspecting device includes an irradiation means for performing optical irradiation in an inspected object (line illumination 2), a light intensity acquiring means (area sensor 3) for acquiring a light intensity distribution about light from the inspected object surface to this optical irradiation; an imaging means (line sensor 4) for acquiring only about predetermined light among the light from the inspected object surface, a regulating means for adjusting the irradiation means (line illumination 20/illumination driving control section 21) for regulating the illumination means (line illumination 2), based on the light intensity distribution obtained from the light intensity acquiring means, and a deciding means (defect deciding processing section 23) for deciding the state of the undulation, formed in the inspected object surface based on the imaging result of the imaging means, after this regulation is carried out. <P>COPYRIGHT: (C)2007,JPO&INPIT |
