发明名称 CMOS image sensor and method of fabricating the same
摘要 In a CMOS image sensor and method of fabricating the same, the CMOS image sensor is comprised of a pixel array generating image signals and a peripheral circuit processing the image signals. In the method, a substrate is provided having a pixel region and a peripheral circuit region. A photo-receiving element and at least one transistor are formed on the pixel region of the substrate and a transistor is formed on the peripheral circuit region of the substrate. A silicide barrier pattern is formed to cover a region where the photo-receiving element is formed. A silicide layer is formed on a predetermined region of the substrate. An interlevel insulation film is formed on the silicide barrier layer. At least one contact hole penetrating the interlevel insulation film is formed, the at least one contact hole exposing a predetermined region of the silicide layer. This is effective to prevent a problem such as an excessive etching due to disagreement of the etch target films between the pixel array and the peripheral circuit.
申请公布号 US2007023802(A1) 申请公布日期 2007.02.01
申请号 US20060493146 申请日期 2006.07.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 OH TAE-SEOK;SONG JAE-HO;PARK JUNG-HO
分类号 H01L31/113;H01L31/062 主分类号 H01L31/113
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