发明名称 Conductive adhesive bonded semiconductor substrates for radiation imaging devices
摘要 The radiation detector/imaging substrate arrays in an x-ray and gamma-ray radiation energy imaging device are described which use an electrically conductive adhesive to provide electron charge signaling continuity between the detector and read-out substrates of the device. The present device utilizes a plurality of electrically conductive bonds each discretely connecting a pixel contact in the pixel pattern to a signal contact in the signal contact pattern, the bonds being an electrically conductive adhesive. This bonding technique is especially useful in detection/imaging arrays having detector substrates comprising Cadmium and Tellurium compositions. The present invention is practicable with semiconductor detector and read-out substrates with or without "bumped" electrical contacts. The electrically conductive bonds utilize either isotropically or anisotropically conductive adhesives.
申请公布号 US7170062(B2) 申请公布日期 2007.01.30
申请号 US20030400381 申请日期 2003.03.27
申请人 OY AJAT LTD. 发明人 VUORELA MIKKO ILMARI
分类号 G01T1/24;G01N23/04;G01T1/161;H01L21/00;H01L25/065;H01L27/00;H01L27/146 主分类号 G01T1/24
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