发明名称 CHIP TYPE FUSE ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a small chip type fuse element allowing formation of a fuse element having a sufficient length without expanding a chip size and excelling in fusing performance. SOLUTION: A series of (for instance, spiral) fuse elements are formed by stacking a plurality of boards 2a-2g on one another, by forming fuse element patterns 3b-3g on two or more layers of the boards 2a-2f, and by connecting the fuse element patterns 3b-3g to one another. The fuse element patterns 3b-3g are connected to one another through, for instance, conductive materials 5 filled in via holes 4 formed on the boards 2b-2f. It is preferable that cavities are formed at least in a part of the boards to be stacked. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007018774(A) 申请公布日期 2007.01.25
申请号 JP20050196671 申请日期 2005.07.05
申请人 TDK CORP 发明人 TSUNODA HIROIKU;IGARASHI KATSUHIKO
分类号 H01H85/08;H01H69/02;H01H85/045;H01H85/046;H01H85/175 主分类号 H01H85/08
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