FABRICATING METHOD FOR IMBEDDED PRINTED CIRCUIT BOARD

摘要

A method for fabricating an embedded printed circuit board is provided to implement a capacitor and a resistor at the same time and an inductor by using a capacitor manufacturing method. A method for fabricating an embedded printed circuit board includes the steps of: sequentially stacking a first conductive layer(13) and a second conductive layer(15) on a base(11); after forming a hole in the second conductive layer(15), filling the hole with a dielectric material(27); after stacking a third conductive layer(17) on the second conductive layer(15), forming a top electrode(18) placed on a top of the dielectric material(27) and a pad(19) to be electrically connected to the first conductive layer(13) by removing a portion of the third conductive layer(17); and after an insulating layer(21) is stacked on the third conductive layer(17), forming a via hole(23) and an external layer circuit(25) electrically connected to the top electrode(18) and the pad(19), respectively.