| 摘要 |
A semiconductor manufacturing apparatus is provided to output a uniform signal from a measuring unit by adjusting a lead screw, when a signal difference between the measuring units is greater than a predetermined value. A semiconductor manufacturing apparatus includes a reaction chamber, a lower electrode member, and an elevating unit. The elevating unit includes a driving motor(31), an operational power delivery unit(32), a lead screw(33), an elevating plate(34), and a measuring unit. The operational power delivery unit delivers operational power to the driving motor. The lead screw is rotatably fixed at a bottom of the reaction chamber, such that the lead screw rotates around an outer periphery of the fixing plate. Plural lead screws are arranged with a constant distance between each other. The elevating plate is fixed at a bottom of the lower electrode member. The lead screws are screw-coupled with the elevating plate, such that the elevating plate is lifted by a predetermined height. The measuring unit is arranged to be adjacent to the respective lead screws at one side surface between the fixing plate and the elevating plate. The measuring unit measures a distance between the fixing plate and the elevating plate.
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