TAPE FOR PROCESSING WAFER AND METHOD OF MANUFACTURING CHIP USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a tape for processing wafers which is used for a dicing step wherein a wafer is cut and divided, and which is applicable for even a case when it is difficult to punch the wafer into a precut shape. SOLUTION: The tape for processing a wafer is stuck to an annular supporting frame to stick a wafer to be processed to the inner opening of the supporting frame in prior to manufacturing of chips. In the tape, an adhesive layer (A) is formed on a base film corresponding to the wafer to be processed, and an adhesive layer (B) is formed on the base film between a part corresponding to the wafer to be processed and the annular supporting frame. In this case, a notch through the front and the back is formed in the adhesive layer (B). COPYRIGHT: (C)2007,JPO&INPIT