| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compact high frequency circuit board which can realize low return loss at a frequency band ranging in wideband, in such a way that a width of bonding pad is made to be wider than signal wiring width, and that a characteristic impedance of the bonding pad is made to be equal to that of the signal wiring. <P>SOLUTION: In a high frequency circuit board 1, a transmission line consisting of a signal wiring 3 and ground wiring 2 is formed, and a bonding pad 4 is formed in a portion of the above-mentioned signal wiring 3, the width of the above-mentioned bonding pad 4 is wider than that of the above-mentioned signal wiring 3, and the characteristic impedance of the above-mentioned bonding pad 4 is equal to that of the above-mentioned signal wiring 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
