发明名称 COMPONENT MOUNTING METHOD AND APPARATUS
摘要 <p>Reference marks arranged at specified intervals on a glass board are recognized, and from its recognition results, offset values for individual areas matching the board size are determined as numerical values for correction use, and further corresponding offset values for individual movement positions of a component placing head are reflected as numerical values for correction use in operation of placing position correction, mark recognition correction, or measurement of placing position offset values, respectively. Thus, high-accuracy placing is achieved. Moreover, correction of positional displacement of a component holding member due to an inclination of the component placing head is performed.</p>
申请公布号 EP1671525(B1) 申请公布日期 2007.01.24
申请号 EP20050750066 申请日期 2005.06.02
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 OKUDA, OSAMU;KAWASE, TAKEYUKI;YOSHIDOMI, KAZUYUKI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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