发明名称 Inline connection setting method and device and substrate processing devices and substrate processing system
摘要 It at least includes a step at which a coating and developing apparatus requests an exposure apparatus, connected inline thereto, to transfer profile information which is information relating to the exposure apparatus, a step at which the coating and developing apparatus receives the profile information from the exposure apparatus, and a step at which the coating and developing apparatus selects a software file to be used in the coating and developing apparatus, in association with the profile information.
申请公布号 US7167769(B2) 申请公布日期 2007.01.23
申请号 US20050546385 申请日期 2005.08.18
申请人 TOKYO ELECTRON LIMITED 发明人 WADA SHIGEKI
分类号 G06F13/10;G03F7/20;G06F13/14;H01L21/00;H01L21/027 主分类号 G06F13/10
代理机构 代理人
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