摘要 |
A grinding method of helical dies and a grinding device thereof are provided to improve productivity by automatically grinding dies by the composite movement of X-axis, Y-axis and Z-axis movement units. A grinding device(13) of helical dies, comprises a transfer unit(16) arranged on a base(15), and has an elevating member; a jig unit(17) arranged at one side of the transfer unit; a Y-axis movement unit(19) for moving the jig unit in Y-axis direction; an X-axis movement unit(20) for moving dies in X-axis; a grinding unit(23) for grinding the dies by rotating a grinding wheel at a high speed; a Z-axis moving unit for seesaw moving the grinding unit so that the grinding wheel contacts dies only during grinding; an angle setting unit(25) for setting a grinding angle of the grinding wheel; and a sensing unit and a controller(26).
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