SEMICONDUCTOR PACKAGE HAVING Z-SHAPED OUTER LEADS AND PACKAGE STACK STRUCTURE AND METHOD USING THE SAME

摘要

A semiconductor package, and package stacked structure and method using the same are provided to restrain the increase of a package mounting area by using a Z-shaped outer lead. A package body has an upper surface, a lower surface and a lateral surface for connecting the upper surface with the lower surface. At least one or more IC chip is/are embedded in the package body. A lead frame includes an inner lead mechanically electrically connected with the IC chip in the package body and an outer lead prolong from the inner lead to the outside. The outer lead has an upper portion(132a), an intermediate portion and a lower portion(132c). The upper portion of the outer lead is connected with the inner lead. The upper portion of the outer lead is parallel with an upper surface of the package body. The height of the upper portion of the outer lead is slightly smaller than that of the upper surface of the package body. The lower portion of the outer lead is formed parallel with the upper portion. The height of the lower portion of the outer lead is smaller than that of a lower surface of the package body. The gap between the lower portion of the outer lead and the lower surface of the package body is larger than that between the upper portion of the outer lead and the upper surface of the package body.