| 摘要 |
A socket device for testing a semiconductor chip is provided to enable an electrical element to be selectively connected to a plurality of contact pins, equipped with a contact part, and to be detached from a space part, thereby easily testing semiconductor chips of various types without adding a special electrical element to the test board of the semiconductor chip. A socket device(101) for testing a semiconductor chip comprises the followings: a socket body(102) in which a cradle(105) of a predetermined form, where the semiconductor chip(107) is detached, is formed in one side of the upper side and a predetermined space part(M1) is formed in one side of the inside; a contact part(103) which is located at the bottom of the socket body(102) and is configured by a plurality of contact pins(103a) electrically connecting the semiconductor chip(107) with a test board(106); and an electrical element(104) which is selectively connected to the plurality of contact pins(103a), equipped with the contact part(103), and can be detached from the space part(M1).
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